CMP polishing pads are mainly used to achieve flattening and polishing of silicon wafers, metals, ceramics and other materials.
Due to the porous structure and soft abrasive material of the CMP polishing pad, it can adapt to the surface structure of different silicon wafer materials and meet different surface processing needs. In the fields of microelectronics, semiconductors, optoelectronics, etc., CMP polishing pads are increasingly used. Especially in the manufacture of micro-nano devices such as high-performance transistors, integrated circuits, and MEMS, the quality and performance of CMP polishing pads are crucial.
In the CMP process, the main functions of the polishing pad are:
① Make the polishing fluid effectively and evenly distributed to the entire processing area, and provide new polishing fluid for a polishing fluid cycle;
② Remove residues generated by the polishing process (such as polishing debris, polishing debris, etc.) from the polished surface of the workpiece;
③Transfer the mechanical load required for material removal;
④Maintain the mechanical and chemical environment required for the polishing process. In addition to the mechanical properties of the polishing pad, its surface structure characteristics, such as micropore shape, porosity, groove shape, etc., can determine polishing efficiency and flatness indicators by affecting the flow and distribution of the polishing fluid.
1. Avoid excessive stress
Excessive pressure will accelerate the wear of the CMP polishing pad and shorten its life.
2. Regularly replace CMP polishing pads
Regular replacement of CMP polishing pads can ensure the polishing effect and product quality, and can also extend the life of the equipment.
3. Properly handle CMP polishing pads
CMP polishing pads are high-tech materials that require proper handling. Please pay attention to the following matters when using and cleaning:
(1) When using, avoid damage to the surface of the polishing pad such as collision, scratches and tears.
(2) When cleaning, use clean water and detergent, and avoid using harmful substances such as strong acids and alkalis.
(3) During storage, adverse factors such as direct sunlight, high temperature, high humidity, and pressure should be avoided.
Specifications of polishing pad
| Shape | Dimensions (inches / mm) | |
| Rectangle | 23 x 55 “ | 584.2 x 1397 mm |
| 36 x 71 “ | 914 x 1803 mm | |
| Square | 42 x 42 “ | 1066 x 1066 mm |
| 52 x 52 “ | 1320 x 1320 mm | |
| Roundness | φ 26 “ | 660 mm |
| φ 32 “ | 812 mm | |
| φ 38 “ | 965 mm | |
| φ 52 “ | 1320 mm | |
| Custom sizes, shapes and configurations are available | ||
