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Diamond Lapping Suspensions

Diamond polishing fluid is composed of diamond micropowder, composite dispersant and dispersion medium. The formula is diversified, corresponding to different grinding and polishing processes and workpieces, and has strong applicability. Used for grinding silicon, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, sapphire and other semiconductor material substrates and epitaxial wafers, as well as grinding precision ceramics, optical glass, metal materials, cemented carbide and other materials .
Abrasive type polycrystalline diamond,single crystal diamond ,nano diamond
Base type water base,oil base
Application semiconductor material substrates and epitaxial wafers, as well as grinding precision ceramics, optical glass, metal materials, cemented carbide and other materials .
Grain Sizes 0.5μm, 1μm, 3μm, 6μm, 8μm (can be customized according to customer requirements)
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Diamond lapping/polishing liquid
Classfications of diamond lapping liquid

Diamond lapping liquid  (also known as polishing liquid, diamond slurry) includes three different types of polishing slurries: polycrystalline, single crystal and nano. Diamond polishing fluid is composed of diamond micropowder, composite dispersant and dispersion medium. The formula is diversified, corresponding to different grinding and polishing processes and workpieces, and has strong applicability. The product has good dispersion, uniform particle size, complete specifications and stable quality, and is widely used for grinding and polishing hard materials.

1.Polycrystalline diamond grinding fluid

Polycrystalline diamond grinding fluid takes advantage of the good toughness of polycrystalline diamond and can maintain high grinding force while being less prone to scratches during the grinding and polishing process. Polycrystalline diamond grinding fluid is widely used for grinding and polishing various hard materials such as optical crystals, ceramics, cemented carbide, etc.

Grit Sizes(㎛) Oil base Water base Grit Sizes(㎛) Oil base Water base
1/20 PC-N50-O PC-N50-W 1 PC-1-O PC-1-W
1/10 PC-N100-O PC-N100-W 2 PC-2-O PC-2-W
1/5 PC-N200-O PC-N200-W 3 PC-3-O PC-3-W
1/4 PC-N250-O PC-N250-W 4 PC-4-0 PC-4-W
1/2 PC-N500-O PC-N500-W 6 PC-6-O PC-6-W

2.Nano diamond lapping fluid

The spherical shape and fine-grained powder of nanodiamond can achieve ultra-precise polishing effects, and have good dispersion stability, which can keep it from settling for a long time, and the powder does not agglomerate in the dispersion liquid. Widely used in the ultra-precision polishing process of hard materials, which can make the polished surface roughness less than 0.2nm.

Grit Sizes(㎛) Oil base Water base Grit Sizes(㎛) Oil base Water base
1/30 DND-30-O DND-30-W 1/6 DND-160-O DND-160-W
1/20 DND-20-O DND-50-W 1/5 DND-200-O DND-200-W
1/10 DND-10-O DND-100-W 1/4 DND-250-O DND-250-W

3.Single crystal diamond lapping liquid

Single crystal diamond grinding fluid has good cutting force and relatively low processing cost. It is widely used for grinding and polishing super-hard materials.

Grit Sizes(㎛) Oil base Water base Grit Sizes(㎛) Oil base Water base
1/20 MD-N50-O MD-N50-W 1 MD-1-O MD-1-W
1/10 MD-N100-O MD-N100-W 2 MD-2-O MD-2-W
1/5 MD-N200-O MD-N200-W 3 MD-3-O MD-3-W
1/4 MD-N250-O MD-N250-W 4 MD-4-0 MD-4-W
1/2 MD-N500-O MD-N500-W 6 MD-6-O MD-6-W

 

Diamond grinding fluid application range

1.Sapphire processing: grinding or polishing of sapphire materials such as sapphire substrates, LED chips, window films, watch lenses, mobile phone fingerprint recognition films, and mobile phone camera lenses.

2.Metal processing: grinding or polishing of superhard alloy metal materials such as stainless steel, aluminum parts, copper parts, mold steel, mobile phone logos, mobile phone middle frames, mobile phone card slots, mobile phone buttons, mobile phone back panels, medical equipment parts, molds, etc.

3.Ceramic processing: grinding or polishing of zirconia ceramic special-shaped parts, ceramic beads, ceramic disks, aluminum nitride substrates, ceramic ferrules, mobile phone ceramic covers, ceramic fingerprint parts, watch ceramic structural parts, ceramic sleeves and other ceramic materials.

4.Semiconductor processing: grinding or polishing of silicon wafers, germanium, gallium arsenide, indium phosphide, silicon carbide, gallium nitride and other semiconductor materials.

5.Infrared crystal processing: grinding and polishing of laser crystals, magneto-optical crystals, scintillation crystals, birefringent crystals, nonlinear optical crystals and other crystal materials; zinc selenide, germanium, silicon, zinc sulfide, calcium fluoride, magnesium fluoride, lithium niobate , lithium carbonate, sulfur series infrared and other infrared materials grinding or polishing.

Precautions for using diamond grinding fluid:
1. Please shake well before use;
2. When using, it can be diluted with a small amount of distilled water. It is recommended that the original solution be used for better results;
3. Suitable particle size and medium adjustment can be selected according to customer process requirements.

Storage method:
This product needs to be stored above 0-5°C to prevent freezing. It will become ineffective below zero due to the formation of non-redispersible agglomerates.

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