15
Sep
Held from September 9 to 11 at Shenzhen World Exhibition & Convention Center (Bao’an), the 27th China International Optoelectronic Exposition (CIOE 2026) has successfully come to an end. Centered on the theme “AI + Optoelectronics Integration”, this year’s event realized a three‑show synergy of CIOE, IICIE and elexcon. Boasting a total exhibition area of 320,000 m², the expo gathered over 5,000 exhibitors and attracted nearly 190,000 professional visitors across three days, building a high‑impact platform for deep collaboration among the optoelectronics, semiconductor and electronics industries.
Moresuperhard showcased its complete portfolio of superhard cutting‑grinding‑polishing consumables tailored for optoelectronics, semiconductor and precision ceramic applications. Our booth welcomed numerous process engineers, R&D specialists and procurement managers from optical components, lens modules, third‑generation semiconductors, precision ceramics and automotive optoelectronics sectors.
Diamond dicing blades, polishing pads, wafer thinning grinding wheels and diamond polishing slurries stood out as our highlight products, drawing substantial genuine inquiries and real‑world manufacturing pain‑point feedback. Visitors paid close attention to the performance of ultra‑thin metal‑bonded dicing blades for zirconia, functional ceramics and optical lenses; solutions for chipping and rapid wear of SiC / sapphire substrate thinning wheels; as well as selection guidelines for polishing pads and slurries under diverse processing conditions. Our technical team delivered one‑on‑one customized process recommendations addressing practical challenges including dicing cracking, grinding chipping, sub‑surface damage and surface roughness control, earning wide recognition from global attendees.
CIOE 2026 reveals clear industry trends: driven by AI computing power, high‑speed optical interconnection, automotive optics, third‑generation semiconductor substrates and AR/VR optical modules are experiencing accelerated growth. Demand for processing hard‑and‑brittle materials such as quartz windows, sapphire, silicon carbide, lithium niobate and V‑groove circuit substrates keeps surging. Core technical challenges lie in chipping suppression, sub‑surface damage reduction, and the balance between processing efficiency and nanometer‑level surface quality. These trends push upstream superhard tools and polishing consumables toward **abrasive refinement, product customization and integrated process solution delivery**, creating critical opportunities for domestic & global import substitution.
The full processing workflow for optoelectronic hard‑and‑brittle materials covers: sawing & dicing → coarse thinning → fine lapping → V‑groove forming / chamfering → intermediate polishing → ultra‑precision mirror polishing → cleaning & inspection. Every procedure sets stringent requirements on dicing blades, grinding wheels, slurries and polishing pads.
“Behind the prosperity of the optoelectronics industry lie fundamental industrial consumables — the ‘industrial teeth’. Supplying standalone products can hardly satisfy high‑end customers nowadays. Moresuperhard is evolving from a product supplier into a process‑solution provider. We deliver matched superhard consumables and process references based on workpiece characteristics, equipment configurations and production targets, helping downstream partners boost yield and cut overall processing costs,” commented our on‑site technical lead.
Following the show, Moresuperhard will prioritize tiered follow‑ups with collected leads, including sample testing and solution validation. We will keep tracking four key development directions: precision processing for upstream optical communication components, AI‑aided visual inspection for grinding processes, precision grinding demands of automotive optical communication & LiDAR components, and import‑substitution progress of semiconductor & optical substrate consumables. We will continue to iterate our product lines including ultra‑thin dicing blades, vitrified‑bond thinning wheels, gradient‑size diamond slurries and application‑specific polishing pads, and refine integrated cutting‑grinding‑polishing solutions for optoelectronic and semiconductor industries.
Focused on superhard precision processing, Moresuperhard keeps investing in diamond & CBN technology, closing the loop of material formulation, product development and process verification. We aim to cooperate with partners across optoelectronics, semiconductor and high‑end precision manufacturing sectors, supporting industrial upgrading and technological localization worldwide.
Moresuperhard specializes in R&D and manufacturing of diamond & CBN superhard tools and precision polishing consumables. Our product portfolio includes diamond dicing blades, wafer thinning wheels, form grinding tools, diamond slurries and diversified polishing pads. These products are widely adopted for hard‑and‑brittle material processing such as optical glass, semiconductor substrates and precision ceramics, with full technical support covering product selection, sampling and customized process optimization.
