02
Feb
CIOE (China International Optoelectronic Exposition)
China International Optoelectronic Exposition (CIOE) is the world’s largest and most influential comprehensive exhibition of the optoelectronic industry, covering information communication, laser, infrared, ultraviolet, precision optics, chip materials, camera technology and application, intelligent sensing, new display, etc. The panel displays cutting-edge optoelectronic innovation technologies and comprehensive solutions for optoelectronics and applications.
Moresuperhard Participate in CIOE 2023
In 2023, Moresuperhard Optoelectronics Group will go to Shenzhen again to participate in this exhibition, providing “cutting, grinding and polishing”solutions for your processing of high-precision single crystal tools and photovoltaic semiconductor materials.
Recommand exhibits from Moresuperhard company
Precision Diamond Cutting Wheel
Diamond cutting wheel is suitable for precision cutting of wafers, PCB substrates, ceramics, optical fiber connectors, optical glass, electronic parts, semiconductor packaging, etc.
Special diamond grinding wheel for single crystal diamond tool grinding
This series of coarse and fine grinding wheels has been successfully matched with COBORN RG5 and RG9A, EWAG-RS15, FC-200D, MT-188, MT198NC and other well-known diamond tool grinders.The grain size ranges from coarse grinding W40 to ultra-fine grinding 10000#.
Coarse grinding: W40, W20
Semi-fine grinding: W10, W7, W5
Fine grinding: W3.5, W2.5, W1.5
Optical profile grinding wheel
Optical profile diamond grinding wheel is suitable for precision grinding molds, punches, optical grinding ,forming grinding and grinding of precision instrument workpiece materials. In addition, optical prism processing grinding wheels will also be exhibited together.
Back Grinding Wheel for silicon wafer
Back grinding wheel can be used for thinning chips, sapphire substrates, substrate epitaxial wafers, wafers, optical glass, etc.
Metal Diamond pencil edge grinding wheel
Diamond pencil edge grinding wheel is used for chamfering and bevel grinding of silicon, silicon carbide, potassium arsenide, sapphire, semiconductor wafers, LCD&OLED&MLED, glass and other semiconductor material substrates.
Diamond grinding wheel for photovoltaic industry
Cylindrical diamond grinding wheel mainly used for flat grinding and chamfering of polycrystalline silicon, flat and cylindrical grinding monocrystalline silicon.
Double end grinding disc
The double-sided grinding disc can realize double-sided simultaneous grinding of multiple semiconductor wafers and other semiconductor materials, greatly improving the grinding efficiency. Double-sided grinding can effectively remove the wafer cutting damage layer caused by slicing and improve the flatness of the wafer
Polishing pads and diamond lapping paste
Improve the roughness of the wafer by CMP polishing, so that the surface can reach epitaxial wafer level precision. Polishing pad, polishing liquid is suitable for semiconductor materials such as silicon carbide, aluminum nitride, silicon nitride, phosphide steel arsenide and nitride precision grinding and polishing
Moresuperhard company is committed to research and development.Adhering to the concept of “creating more value than grinding”.Moresuperhard continues to provide customers and the market with high-quality “cutting, grinding and polishing” products for your high-precision Single crystal diamond cutting tools, semiconductors, and precision optics industries provide a full range of customized high-efficiency “cutting, grinding and polishing” solutions to help customers truly achieve cost reduction and efficiency increase.
