Products

Cutting Tool Blanks PCD Cutting Machines PCD/ CBN Grinding Wheel MCD Tools Ginding Peripheral Grinding Wheel Cermet Tools Grinding Diamond Parts Grinding Grinding Machines Dressing Brazing

Semi-conductor Materials Processing

Cutting Grinding Polishing

Carbon Materials Processing

Cutting Grinding Polishing

New Metal Materials Processing

Grinding Cutting

Application

News

Industry Solutions

Company News

PDF Downloads

Email:

pcd@moresuperhard.com

Whatsapp:

008617700605088

Tel:

008617700605088

Language:

English English English

Products

MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.

Home > Products > Semi-conductor Materials Processing > Cutting

All Cutting tools for difficult-to-cut materials Optical Materials processing Ceramic Materials Processing Composite Materials Processing Diamond Materials Processing Semi-conductor Materials Processing Carbon Materials Processing New Metal Materials Processing

All kind of diamond dicing blades for wafer dicing and package dicing.High dicing efficiency and dicing precision.

Cutting Grinding Polishing

Diamond Dicing Blade -Hub Blade

Applications Mainly used for dicing wafers during the packaging and testing stage of semiconductor manufacturing to achieve mutual separation of individual chips.

Mold 1A8

Bond Electroformed bond

Features High toughness, high precision, ultra-thin, long life, and strong versatility; The cutting life and product quality are comparable to the first-line brands in the industry, and the price-performance ratio is high.

Resin Bond Diamond Dicing Blades-hubless type

Applications High-speed, efficient and precise grooving and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc.

Features Improve the quality of the processed surface; sharp cutting can effectively reduce the number of grinding wheel dressings or eliminate the need for dressing; high cutting accuracy, wide range of applications; various sizes and specifications, short delivery cycle.

Specifications φ56-110mm

Metal Bond Diamond Dicing Blades

Applications semiconductor packaging, glass, ceramics, metal materials

Features The metal-bonded integral cutting grinding wheel has strong ability to hold abrasives, high precision, good wear resistance and shape retention, and long service life.

Moresuperhard advantages Short delivery cycle, good stability and high cost performance

Diamond Band Saw Blades

Blade edge configurations available continuous rim, segmented, gulleted, Scallop Segment

Blade Backing Materials Steel Alloy, Stainless Steel

Production Method Electroplated diamond band saw blade&metal sintered diamond band saw blade

Applications Monocrystalline silicon, polycrystalline silicon, metal, ceramic, graphite and other composite materials

dressing board for diamond dicing baldes

Precut Board/Dresser Board

Abrasives silicon carbide or corundum

Bonder resin bond and ceramic bond

Applications The dresserboard is mainly used for dressing electroplated diamond dicing blades and sintered diamond dicing blades

Features Greatly reduces precut-related costs by significantly shortening processing time

Not sure which product is right for you? At Moresuperhard, we bring our experience to help you create the ideal customization your business needs.

0086-17700605088

Email: pcd@moresuperhard.com

Contact

pcd@moresuperhard.com

008617700605088