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Semi-conductor Materials Processing

Cutting Grinding Polishing

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Cutting Grinding Polishing

New Metal Materials Processing

Grinding Cutting

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MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.

Home > Products > Semi-conductor Materials Processing > Grinding

All Cutting tools for difficult-to-cut materials Optical Materials processing Ceramic Materials Processing Composite Materials Processing Diamond Materials Processing Semi-conductor Materials Processing Carbon Materials Processing New Metal Materials Processing

Cutting Grinding Polishing

Resin Bond Diamond Back Grinding Wheel

Applications Silicon wafer, Compound semiconductor wafers, Electronics components, etc

Grit Sizes 200#-10000#,suitable for rough grinding

Features Excellent self-sharpening and elasticity ,High machining accuracy and surface quality

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc

Vitrified Bond Diamond Back Grinding Wheel

Applications Used for post-grinding, pre-grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial silicon wafers, gallium arsenide, gallium nitride wafers, silicon-based wafers, etc.

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc

Diameter 200mm, 250mm, 280mm, 300mm, 350mm

Metal Bond Diamond Back Grinding Wheel

Applications Sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer

Diameter 304mm,254mm,255mm,175mm,150mm

Mold 6A2T

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

diamond grinding wheel for wafer chamfer

Diamond Edge Grinding Wheel

Bonded resin bond ,metal bond

Diameter 50mm-200mm

Grit Sizes 400#-3000#

Applications semiconductor materials processing

Diamond grinding wheel for silicon ingot

Bond resin bond ,metal bond ,hybrid bond

Application fields Mainly used for grinding, chamfering and grinding of polycrystalline silicon and grinding and rounding of monocrystalline silicon.

Main features high-speed and efficient grinding, long service life, high material removal efficiency, low damage layer on the surface of the processed workpiece, and high smoothness.

CMP Pad Conditioners

Abrasives Diamond

Manufacturing process Electroplating and sintering

Applications Various polishing pad and grinding disc

Features High precision and long service life

Not sure which product is right for you? At Moresuperhard, we bring our experience to help you create the ideal customization your business needs.

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Email: pcd@moresuperhard.com

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pcd@moresuperhard.com

008617700605088