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MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.
Home > Products > Semi-conductor Materials Processing
All Cutting tools for difficult-to-cut materials Optical Materials processing Ceramic Materials Processing Composite Materials Processing Diamond Materials Processing Semi-conductor Materials Processing Carbon Materials Processing New Metal Materials Processing
Cutting Grinding Polishing
metal bond diamond back grinding wheel
Metal Bond Diamond Back Grinding Wheel
Applications Sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer
Diameter 304mm,254mm,255mm,175mm,150mm
Mold 6A2T
Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
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diamond grinding wheel for wafer chamfer
Diamond Edge Grinding Wheel
Bonded resin bond ,metal bond
Diameter 50mm-200mm
Grit Sizes 400#-3000#
Applications semiconductor materials processing
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Cutting tools for difficult-to-cut materials
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New Metal Materials Processing
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