CMP (Chemical Mechanical Polishing) dresser is a special tool used to dress the grinding disc or polishing pad during the process of Chemical Mechanical Polishing. Its main function is to perform fine dressing on the surface of the polishing pad through diamond or other hard materials to restore its flatness and grinding performance, thereby ensuring the stability of the process and the polishing quality.
High-precision dressing: The diamond particles embedded on the surface of the dresser can evenly dress the surface of the polishing pad to ensure the smoothness of the polishing process.
Excellent wear resistance: The use of high-quality diamond materials can be used for a long time and extend the life of the product.
Stable performance: The optimized structural design ensures the shape accuracy and surface flatness during the dressing process.
Strong adaptability: Suitable for different types of CMP polishing pads and grinding discs.
Semiconductor wafer manufacturing (such as silicon wafers, compound semiconductor wafers).
Precision optical component processing.
Surface treatment of flat panel display (TFT-LCD) glass substrates.
| Parameter | Specifications |
| Diameter | Customized according to customer needs, general diameter range: Φ50mm-Φ150mm |
| Grit Sizes | 40/50，50/60，80/100，100/120etc |
| Bond | Electroplated bond,metal bond and resin bond |
| Thickness Tolerance | ±0.02mm |
| Flatness | ≤5μm |
| Mounting interface | Designed according to equipment requirements, optional aperture or thread connection |
