1.High-Efficiency Cutting: The hub-type dicing blade employs advanced cutting technology, enabling fast and efficient cutting processes, thereby improving production efficiency.
2.Precise Positioning: With precision-designed hubs and blade structures, it achieves accurate positioning and cutting of wafers, ensuring cutting accuracy and consistency.
3.High Stability: Manufactured using high-quality materials, the tool boasts a stable structure and long service life, maintaining stable performance during prolonged production operations.
4..Wide Applicability: The hub-type dicing blade is suitable for various types of wafer materials, including silicon, silicon carbide, gallium nitride, etc., with a wide range of application areas.
5.Ease of Operation: Featuring a user-friendly interface and control system, it is easy to operate, reducing the technical requirements for operators.
Applications of electroformed hub blades
1.Semiconductor Industry: Used for cutting and processing semiconductor chips.
2.Optoelectronics Industry: Applied in the cutting and processing of optoelectronic devices.
3.Microelectronics Industry: Utilized for cutting and processing microelectronic components.
4.Other Fields: Suitable for various industries requiring precise cutting of hard and brittle materials.
