Home > Products > Diamond Dicing Blade -Hub Blade

Diamond Dicing Blade -Hub Blade

The blade of the diamond dicing blade is ultra-thin and has ultra-high strength. The thinnest blade thickness is 10-15 microns and the thickest is more than 100 microns. It meets the size requirements of various block widths and grain sizes, and can realize ultra-thin silicon wafers and small wafers. High-quality cutting of silicon wafers to avoid back chipping or cracking and effectively solve the problem of back chipping.
Applications Mainly used for dicing wafers during the packaging and testing stage of semiconductor manufacturing to achieve mutual separation of individual chips.
Mold 1A8
Bond Electroformed bond
Features High toughness, high precision, ultra-thin, long life, and strong versatility; The cutting life and product quality are comparable to the first-line brands in the industry, and the price-performance ratio is high.
Get a quote
hub wafer dicing blade
Electroformed diamond dicing blade
Wafer dicing blades
hub type wafer dicing blade
wafer dicing
wafer dicing 2
hub wafer dicing blade
Electroformed diamond dicing blade
Wafer dicing blades
hub type wafer dicing blade
wafer dicing
wafer dicing 2
Electroformed bond diamond dicing blade for wafer dicing
Features of hub type diamond dicing blades

1.High-Efficiency Cutting: The hub-type dicing blade employs advanced cutting technology, enabling fast and efficient cutting processes, thereby improving production efficiency.
2.Precise Positioning: With precision-designed hubs and blade structures, it achieves accurate positioning and cutting of wafers, ensuring cutting accuracy and consistency.
3.High Stability: Manufactured using high-quality materials, the tool boasts a stable structure and long service life, maintaining stable performance during prolonged production operations.
4..Wide Applicability: The hub-type dicing blade is suitable for various types of wafer materials, including silicon, silicon carbide, gallium nitride, etc., with a wide range of application areas.
5.Ease of Operation: Featuring a user-friendly interface and control system, it is easy to operate, reducing the technical requirements for operators.

Electroformed diamond dicing blade

Applications of electroformed hub blades

1.Semiconductor Industry: Used for cutting and processing semiconductor chips.
2.Optoelectronics Industry: Applied in the cutting and processing of optoelectronic devices.
3.Microelectronics Industry: Utilized for cutting and processing microelectronic components.
4.Other Fields: Suitable for various industries requiring precise cutting of hard and brittle materials.

hub wafer dicing blade

Specifications of electroformed diamond dicing blades

drawing of hub type diamond dicing blades

Exposure(μm) 380 510 640 760 890 1020 1150 1270 Grit Size
Kerf width(μm) 380-510 510-640 640-760 760-890 890-1020 1020-1150 1150-1270 1270-1400 #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20 20*380 20*510
21-25 25*380 25*510 25*640
26-30 30*380 30*510 30*640 30*760 30*890 20*1020
31-35 35*380 35*510 35*640 35*760 35*890 35*1020
36-40 40*380 40*510 40*640 40*760 40*890 40*1020 40*1150
41-50 50*380 50*510 50*640 50*760 50*890 50*1020 50*1150
51-60 60*510 60*640 60*760 60*890 60*1020 60*1150 60*1270
61-70 70*640 70*760 70*890 70*1020 70*1150 70*1270
71-80 80*890 80*1020 80*1150 80*1270
81-90 90*1020 90*1150 90*1270
Special size can be designed according to customers’ requirement
You may also be interested in
tech@moresuperhard.com
008617700605088