Home > Products > Diamond Grinding Wheel for Ceramic Bonding Tools

Diamond Grinding Wheel for Ceramic Bonding Tools

Ceramic bonding tools are also called porcelain nozzles. Ceramic bonding tools are made of high-hardness ceramic materials (such as aluminum oxide, silicon nitride, silicon carbide, etc.) and are widely used in precision cutting and microelectronic packaging. Diamond grinding wheels are ideal tools for grinding ceramics due to their extremely high hardness and wear resistance. Resin diamond grinding wheels and metal diamond grinding wheels are suitable for grinding ceramic bonding tools.
Bond Metal bond and resin bond
Abarsives Synthetic diamond
Grinding mold External grinding or cylindrical grinding
Applications Grinding ceramic bonding tools
Get a quote
resin bond diamond grinding wheel c
ceramic bonding tools grinding wheel
diamond wheel for chip bonding tools
metal diamond grinding wheel c
external grinding wheel c
14A1 grinding wheel
resin bond diamond grinding wheel c
ceramic bonding tools grinding wheel
diamond wheel for chip bonding tools
metal diamond grinding wheel c
external grinding wheel c
14A1 grinding wheel
Ginding Wheel for Ceramic bonding tools
Resin bond & Metal bond Diamond Grinding Wheel

Ceramic bonding tools are prone to chipping and burning during grinding due to their high hardness and low toughness. Moresuperhard grinding wheels have excellent heat dissipation performance and sharp cutting ability, which can effectively reduce grinding heat accumulation, reduce the risk of workpiece burns, and improve the service life and processing accuracy of the tool.

ceramic chip bonding tools ceramic bonding tools

Moresuperhard provide a variety of specifications and formulas to meet different types of ceramic tool processing needs. At the same time, we can customize the grinding wheel specifications according to customer requirements to meet special application scenarios.

Features of Ceramic Bonding Tools Grinding Wheel

High precision: ensure the smoothness and dimensional stability of the grinding surface, and reduce the subsequent processing steps
High wear resistance: use high-quality abrasives, longer service life, and reduce the frequency of replacement
Good heat dissipation: reduce heat accumulation, reduce the risk of workpiece burns, and improve processing stability
Low vibration: optimize balance, reduce vibration, ensure processing accuracy and improve efficiency
Wide range of application: suitable for ceramic materials such as zirconium oxide, aluminum oxide, silicon nitride
Customizable: provide different specifications, particle sizes and binder formulas to meet personalized needs

resin bond diamond grinding wheel c diamond wheel for chip bonding tools

Specifications of Grinding Wheel for Ceramic Bonding Tools

Specifications
Diameter(D) 50mm/75mm//100mm / 125mm / 150mm / 200mm
Thickness(T) 1mm / 2mm / 5mm / 10mm
Hole(H) 20mm / 25.4mm / 32mm
Grit 500#-3000#
Bond Resin bond/metal bond
Applied Materials Alumina ceramics / Silicon nitride ceramics / Silicon carbide ceramics
Application Areas Electronic ceramics, semiconductors, precision tools, aerospace

If you have special requirements, please provide detailed information and we can customize the appropriate grinding wheel specifications!

 

How to grind ceramic bonding tools?

1.Suitable grinding wheel and grit sizes

Resin-bonded diamond wheels and metal-bonded diamond wheels are suitable for grinding ceramic chip bonding tools. Choose the appropriate diamond wheel grit according to the different grinding stages:
Rough grinding: Use a coarse-grained diamond wheel of D46 or D76 for preliminary removal of excess material.
Semi-fine grinding: Use a medium-grained diamond wheel of D20 or D30 to further refine the tool shape.
Fine grinding and polishing: Use a fine-grained diamond wheel of D7 or D10 to ensure surface finish and accuracy.

2.Determine grinding parameters
Reasonable grinding parameters (such as grinding speed, feed speed, grinding depth, etc.) have a significant impact on the final processing quality. The recommended parameters are as follows:
Grinding speed: According to the material hardness and grinding wheel characteristics, it is usually controlled at 20-30 m/s.
Feed speed: Keep it at 0.01-0.1 mm/s to avoid excessive feed speed causing tool breakage.
Grinding depth: Each grinding depth should be less than 0.02 mm, and the grinding depth should be reduced during the fine grinding stage to ensure surface quality.

 

You may also be interested in
tech@moresuperhard.com
008617700605088