products

All Cutting tools for difficult-to-cut materials Optical Materials processing Ceramic Materials Processing Composite Materials Processing Diamond Materials Processing Semi-conductor Materials Processing Carbon Materials Processing New Metal Materials Processing

Diamond Band Saw Blades

Blade edge configurations available continuous rim, segmented, gulleted, Scallop Segment

Blade Backing Materials Steel Alloy, Stainless Steel

Production Method Electroplated diamond band saw blade&metal sintered diamond band saw blade

Applications Monocrystalline silicon, polycrystalline silicon, metal, ceramic, graphite and other composite materials

Diamond Lapping Suspensions

Abrasive type polycrystalline diamond,single crystal diamond ,nano diamond

Base type water base,oil base

Application semiconductor material substrates and epitaxial wafers, as well as grinding precision ceramics, optical glass, metal materials, cemented carbide and other materials .

Grain Sizes 0.5μm, 1μm, 3μm, 6μm, 8μm (can be customized according to customer requirements)

CMP Polishing Pad

Materials Polyurethane polishing pad

Features Polyurethane has good elasticity and wear resistance and can maintain relatively stable performance under the action of constant abrasives

Applications CMP polishing and flattening of silicon wafers, metals, ceramics and other materials

Specifications Customized according to your requirements

Diamond grinding wheel for silicon ingot

Bond resin bond ,metal bond ,hybrid bond

Application fields Mainly used for grinding, chamfering and grinding of polycrystalline silicon and grinding and rounding of monocrystalline silicon.

Main features high-speed and efficient grinding, long service life, high material removal efficiency, low damage layer on the surface of the processed workpiece, and high smoothness.

diamond grinding wheel for wafer chamfer

Diamond Edge Grinding Wheel

Bonded resin bond ,metal bond

Diameter 50mm-200mm

Grit Sizes 400#-3000#

Applications semiconductor materials processing

Vitrified Bond Diamond Back Grinding Wheel

Applications Used for post-grinding, pre-grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial silicon wafers, gallium arsenide, gallium nitride wafers, silicon-based wafers, etc.

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc

Diameter 200mm, 250mm, 280mm, 300mm, 350mm

Resin Bond Diamond Back Grinding Wheel

Applications Silicon wafer, Compound semiconductor wafers, Electronics components, etc

Grit Sizes 200#-10000#,suitable for rough grinding

Features Excellent self-sharpening and elasticity ,High machining accuracy and surface quality

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc

Metal Bond Diamond Back Grinding Wheel

Applications Sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer

Diameter 304mm,254mm,255mm,175mm,150mm

Mold 6A2T

Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Resin Bond Diamond Dicing Blades-hubless type

Applications High-speed, efficient and precise grooving and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc.

Features Improve the quality of the processed surface; sharp cutting can effectively reduce the number of grinding wheel dressings or eliminate the need for dressing; high cutting accuracy, wide range of applications; various sizes and specifications, short delivery cycle.

Specifications φ56-110mm

Metal Bond Diamond Dicing Blades

Applications semiconductor packaging, glass, ceramics, metal materials

Features The metal-bonded integral cutting grinding wheel has strong ability to hold abrasives, high precision, good wear resistance and shape retention, and long service life.

Moresuperhard advantages Short delivery cycle, good stability and high cost performance

Diamond Dicing Blade -Hub Blade

Applications Mainly used for dicing wafers during the packaging and testing stage of semiconductor manufacturing to achieve mutual separation of individual chips.

Mold 1A8

Bond Electroformed bond

Features High toughness, high precision, ultra-thin, long life, and strong versatility; The cutting life and product quality are comparable to the first-line brands in the industry, and the price-performance ratio is high.

PCD Inserts

high abrasive resistance

high processing precision

good thermal conductivity

long service life

Not sure which product is right for you? At Moresuperhard, we bring our experience to help you create the ideal customization your business needs.

0086-17700605088

Email: pcd@moresuperhard.com

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