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MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.
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double sided grinding ceramic
Double-end diamond grinding disc for ceramic
Model 1A2T,2A2T,6A2B
Diameter 300mm-1500mm
Abrasives Diamond
Applications Different ceramic materials workpiecs like alumina sealing rings,silicon carbide ceramic carbide,etc
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centerless grinding ceramic rods
Centerless Diamond grinding wheel for Ceramic Rods
Type centerless grinding
Mold 1A1,9A1,6A1
Bond resin,vitrified
Features The workpiece surface is smooth, the grinding wheel has good straightness retention, and the grinding workpiece has no taper
Applications Ceramic rods for electronic components ,Ceramic shafts for precision instruments etc
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resin diamond grinding wheel for ceramic
Resin Diamond Grinding Wheel for Ceramic Workpieces
Bond Resin bond
Mold 1A1,14A1
Grinding Materials Alumina ceramic,Zirconia ceramics, silicon carbide ceramics, etc.
Grinding Method External grinding
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diamond cutting wheel
Diamond Cutting Disc for Ceramic Materils
Bond resin bond,metal bond
Diameter 4''-16''
Suitable materials Cutting different ceramic materials like alumina ceramic,nitride ceramic,carbide ceramic etc
Features Good sharpness, high precision and high wear resistance
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sg grinding wheel for gear
SG Grinding Wheel for Grinding 20CrMnTiH
Types internal grinding,external grinding ,form grinding,gear grinding
Features High wear resistances,High hardness,high precision,high efficiency
Applications bever gear,worm,guide rail,ball track,gear,tools
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ultra short fiber polishing pad
Microfiber Polishing Pad
Model MSH60,MSH80,MSH-Q20
Applications Rough and medium polishing of high hardness workpieces
Features Stable performance and long services life
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dressing board for diamond dicing baldes
Precut Board/Dresser Board
Abrasives silicon carbide or corundum
Bonder resin bond and ceramic bond
Applications The dresserboard is mainly used for dressing electroplated diamond dicing blades and sintered diamond dicing blades
Features Greatly reduces precut-related costs by significantly shortening processing time
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diamond band saw blades
Diamond Band Saw Blades
Blade edge configurations available continuous rim, segmented, gulleted, Scallop Segment
Blade Backing Materials Steel Alloy, Stainless Steel
Production Method Electroplated diamond band saw blade&metal sintered diamond band saw blade
Applications Monocrystalline silicon, polycrystalline silicon, metal, ceramic, graphite and other composite materials
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diamond lapping liquid
Diamond Lapping Suspensions
Abrasive type polycrystalline diamond,single crystal diamond ,nano diamond
Base type water base,oil base
Application semiconductor material substrates and epitaxial wafers, as well as grinding precision ceramics, optical glass, metal materials, cemented carbide and other materials .
Grain Sizes 0.5μm, 1μm, 3μm, 6μm, 8μm (can be customized according to customer requirements)
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polishing pad
CMP Polishing Pad
Materials Polyurethane polishing pad
Features Polyurethane has good elasticity and wear resistance and can maintain relatively stable performance under the action of constant abrasives
Applications CMP polishing and flattening of silicon wafers, metals, ceramics and other materials
Specifications Customized according to your requirements
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grinding wheel for ingot
Diamond grinding wheel for silicon ingot
Bond resin bond ,metal bond ,hybrid bond
Application fields Mainly used for grinding, chamfering and grinding of polycrystalline silicon and grinding and rounding of monocrystalline silicon.
Main features high-speed and efficient grinding, long service life, high material removal efficiency, low damage layer on the surface of the processed workpiece, and high smoothness.
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diamond grinding wheel for wafer chamfer
Diamond Edge Grinding Wheel
Bonded resin bond ,metal bond
Diameter 50mm-200mm
Grit Sizes 400#-3000#
Applications semiconductor materials processing
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