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Home
About Us
Company Profile
Customer Reviews
FAQ
Videos Center
Products
Glass
Composite Materials
Ceramic Materials
Superhard Materials
Non-ferrous Metals
Ferrous Metals
Cutting tools for difficult-to-cut materials
Optical Materials processing
Grinding wheel for optical windows
Diamond cutting wheel for glass
Ceramic Materials Processing
Cutting
Surface Grinding
Centerless Grinding
External Grinding
Composite Materials Processing
Cutting
Grinding
Diamond Materials Processing
Cutting Tool Blanks
PCD Cutting Machines
PCD/ CBN Grinding Wheel
MCD Tools Ginding
Peripheral Grinding Wheel
Cermet Tools Grinding
Diamond Parts Grinding
Grinding Machines
Dressing
Brazing
Semi-conductor Materials Processing
Cutting
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Cutting
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Products
MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.
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Glass
Composite Materials
Ceramic Materials
Superhard Materials
Non-ferrous Metals
Ferrous Metals
Cutting tools for difficult-to-cut materials
Optical Materials processing
Ceramic Materials Processing
Composite Materials Processing
Diamond Materials Processing
Semi-conductor Materials Processing
Carbon Materials Processing
New Metal Materials Processing
Vitrified Bond Diamond Back Grinding Wheel
Applications
Used for post-grinding, pre-grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial silicon wafers, gallium arsenide, gallium nitride wafers, silicon-based wafers, etc.
Applicable grinding machines
NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
Diameter
200mm, 250mm, 280mm, 300mm, 350mm
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Resin Bond Diamond Back Grinding Wheel
Applications
Silicon wafer, Compound semiconductor wafers, Electronics components, etc
Grit Sizes
200#-10000#,suitable for rough grinding
Features
Excellent self-sharpening and elasticity ,High machining accuracy and surface quality
Applicable grinding machines
NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
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Metal Bond Diamond Back Grinding Wheel
Applications
Sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer
Diameter
304mm,254mm,255mm,175mm,150mm
Mold
6A2T
Applicable grinding machines
NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
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Resin Bond Diamond Dicing Blades-hubless type
Applications
High-speed, efficient and precise grooving and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc.
Features
Improve the quality of the processed surface; sharp cutting can effectively reduce the number of grinding wheel dressings or eliminate the need for dressing; high cutting accuracy, wide range of applications; various sizes and specifications, short delivery cycle.
Specifications
φ56-110mm
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Metal Bond Diamond Dicing Blades
Applications
semiconductor packaging, glass, ceramics, metal materials
Features
The metal-bonded integral cutting grinding wheel has strong ability to hold abrasives, high precision, good wear resistance and shape retention, and long service life.
Moresuperhard advantages
Short delivery cycle, good stability and high cost performance
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Diamond Dicing Blade -Hub Blade
Applications
Mainly used for dicing wafers during the packaging and testing stage of semiconductor manufacturing to achieve mutual separation of individual chips.
Mold
1A8
Bond
Electroformed bond
Features
High toughness, high precision, ultra-thin, long life, and strong versatility; The cutting life and product quality are comparable to the first-line brands in the industry, and the price-performance ratio is high.
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PCD Inserts
high abrasive resistance
high processing precision
good thermal conductivity
long service life
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Wire Cut EDM
Wire Cut EDM, also known as (wire electrical discharge machining or wire EDM) is a high-precision method for cutting nearly any electrically conductive material
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Vitrified Diamond Wheel for PCB V-Cutter
Grinding wheel
Vitrified diamond cup wheels
Type
6A2 diamond wheel
Grit
W40, W28, W20
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Vacuum Furnace
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Ultra Thick PCD Blanks for Solid PCD Tools
Diameter
1mm-19mm
superhard layer can be as thick as
4mm-6mm
Applications
solid PCD tools are especially favored in the cutting of glass, ceramics, graphite, sapphire, carbon fiber and other materials
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PCD/MCD Wire-drawing Die Blanks
Core materials
ND,PCD, MCD,HPHT
Core Shape
Round,Square,Hexagon,Octagon and other customized shapes.
Applications Field
high-precision wires used in electronic devices, radar, television, instrumentation and aerospace
Characteristic
strong wear resistance and extremely high service life
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tech@moresuperhard.com
008617700605088