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MORESUPERHARD is a professional manufacturer of grinding, cutting, polishing and dressing tools.
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vitrified bond diamond back grinding wheel
Vitrified Bond Diamond Back Grinding Wheel
Applications Used for post-grinding, pre-grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial silicon wafers, gallium arsenide, gallium nitride wafers, silicon-based wafers, etc.
Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
Diameter 200mm, 250mm, 280mm, 300mm, 350mm
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resin bond diamond back grinding wheel
Resin Bond Diamond Back Grinding Wheel
Applications Silicon wafer, Compound semiconductor wafers, Electronics components, etc
Grit Sizes 200#-10000#,suitable for rough grinding
Features Excellent self-sharpening and elasticity ,High machining accuracy and surface quality
Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
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metal bond diamond back grinding wheel
Metal Bond Diamond Back Grinding Wheel
Applications Sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer
Diameter 304mm,254mm,255mm,175mm,150mm
Mold 6A2T
Applicable grinding machines NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
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resin bond diamond dicing blades
Resin Bond Diamond Dicing Blades-hubless type
Applications High-speed, efficient and precise grooving and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc.
Features Improve the quality of the processed surface; sharp cutting can effectively reduce the number of grinding wheel dressings or eliminate the need for dressing; high cutting accuracy, wide range of applications; various sizes and specifications, short delivery cycle.
Specifications φ56-110mm
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metal bond diamond dicing blades
Metal Bond Diamond Dicing Blades
Applications semiconductor packaging, glass, ceramics, metal materials
Features The metal-bonded integral cutting grinding wheel has strong ability to hold abrasives, high precision, good wear resistance and shape retention, and long service life.
Moresuperhard advantages Short delivery cycle, good stability and high cost performance
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hub type diamond dicing blade
Diamond Dicing Blade -Hub Blade
Applications Mainly used for dicing wafers during the packaging and testing stage of semiconductor manufacturing to achieve mutual separation of individual chips.
Mold 1A8
Bond Electroformed bond
Features High toughness, high precision, ultra-thin, long life, and strong versatility; The cutting life and product quality are comparable to the first-line brands in the industry, and the price-performance ratio is high.
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PCD inserts
PCD Inserts
high abrasive resistance
high processing precision
good thermal conductivity
long service life
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EDM wire cut
Wire Cut EDM
Wire Cut EDM, also known as (wire electrical discharge machining or wire EDM) is a high-precision method for cutting nearly any electrically conductive material
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grinding PCB-V cutter
Vitrified Diamond Wheel for PCB V-Cutter
Grinding wheel Vitrified diamond cup wheels
Type 6A2 diamond wheel
Grit W40, W28, W20
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vacuum furnace
Vacuum Furnace
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ultra thick PCD blanks
Ultra Thick PCD Blanks for Solid PCD Tools
Diameter 1mm-19mm
superhard layer can be as thick as 4mm-6mm
Applications solid PCD tools are especially favored in the cutting of glass, ceramics, graphite, sapphire, carbon fiber and other materials
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mcd diamond drawing die core
PCD/MCD Wire-drawing Die Blanks
Core materials ND,PCD, MCD,HPHT
Core Shape Round,Square,Hexagon,Octagon and other customized shapes.
Applications Field high-precision wires used in electronic devices, radar, television, instrumentation and aerospace
Characteristic strong wear resistance and extremely high service life
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