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Resin Bond Diamond Dicing Blades-hubless type

Resin diamond dicing blade is a sintered scribing blade made of thermosetting resin as a binder and sintered with diamond abrasive. The resin dicing blade has the characteristics of good elasticity, thin thickness and high precision. It is suitable for processing glass, ceramics and magnetic materials. , cemented carbide and various semiconductor packaging materials.
Applications High-speed, efficient and precise grooving and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc.
Features Improve the quality of the processed surface; sharp cutting can effectively reduce the number of grinding wheel dressings or eliminate the need for dressing; high cutting accuracy, wide range of applications; various sizes and specifications, short delivery cycle.
Specifications φ56-110mm
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Resin Bond Diamond Dicing Blades
Features of resin diamond dicing blade

1. Resin diamond scribing blades have good elasticity and can maximize cutting capabilities

2. High precision, sharp cutting, good self-sharpening, and fast particle renewal, effectively ensuring the good cutting status of the blade

3. According to different processing materials, different cutting tools can be customized and designed, and the cutting edge can also be grooved to meet different processing needs

4. The blade can be adapted to the mainstream dicing machines in the market and is an important tool for semiconductor cutting

dicing semiconductor package resin bond diamond dicing blades

Moresuperhard resin diamond dicing blade help you solve cutting problems

1. Diamond dicing blade life

2. Collapse problem

3. Cutting and layering

4. There are burrs on the edge of the product

Applications of resin bond diamond dicing blade

Semiconductor: BGA cutting, PCB board cutting, QFN cutting, DFN cutting

Optical glass: optical glass, quartz glass, etc.

Metal materials: micro drills, milling cutter rods, rare earth magnetic materials, etc.

Cutting ceramics: silicon carbide, zirconia, etc.

applications of metal diamond dicing blades

Resin bond diamond dicing blade specifications

specifications of diamond dicing blades

 

 

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