• Excellent self-sharpening and elasticity
• High processing efficiency and low processing temperature
• High machining accuracy and surface quality
•Superior finishing quality
•Long-life specification – high wear resistance
•Large product range – able to process compound semiconductor wafers and crystal materials
Applications of Resin bond diamond back grinding wheel
Silicon wafer, sapphire, gallium nitride, gallium arsenide
| Model | D (mm) | T (mm) | H (mm) |
6A2/6A2H |
175 | 30, 35 | 76 |
| 200 | 35 | 76 | |
| 350 | 45 | 127 | |
6A2T |
195 | 22.5, 25 | 170 |
| 280 | 30 | 228.6 | |
|
6A2T(three ellipses) |
350 | 35 | 235 |
| 209 | 22.5 | 158 | |
| Other specifications can be produced according to customers’ requirement. | |||
